Speaker
Description
Scalable surface-electrode ion traps require advanced microfabrication techniques capable of
integrating different trap architectures as well as integrated electric and photonic circuits with
high reliability. Microfabricated surface-electrode ion traps provide a promising platform for
quantum information processing, but their fabrication remains challenging in terms of
integration density and scalability [1,2]. Quantum operations rely on laser beams,
microwaves, and DC and RF electric fields [3], making the integration of optical and electrical
pathways essential for scalable architectures [4]. Through-substrate vias (TSVs) enable dense
electrical routing with reduced parasitic effects, while integrated waveguides allow on-chip
laser delivery [5,6]. Here, TSVs are produced using selective laser-induced etching (SLE), which
enables structures with high aspect ratios and modifications of the refractive index in
materials such as fused silica and sapphire, while integrated waveguides are realized in several
ways using SLE and e-beam lithography. The goal is to combine the various microfabrication
technologies to enable a scalable multilayer trap architecture.
(1) Seidelin, S. et al. Physical Review Letters 2006, 96, 253003.
(2) Blatt, R.; Wineland, D. Nature 2008, 453, 1008–1015.
(3) Ospelkaus, C. et al.Nature 2011, 476, 181–184.
(4) Hahn, H et al. Applied Physics B 2019, 125, 154.
(5) Zhao, P. et al. Applied Physics Letters 2021, 118, 124003.
(6) Niffenegger,R.J et al.Nature 2020, 586, 538–542
| Academic level | PhD student |
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